The AVP, a size, weight, and power (SWaP) optimized advanced video processor, provides best-in-class artificial intelligence performance for thermal infrared and visible camera perception systems. It incorporates the latest Qualcomm® QCS8550, the industry’s most advanced mobile processor system on chip (SoC) featuring up to 48 TOPS inference compute performance. The QCS8550 is part of Qualcomm’s Product Longevity Program, ensuring future-proof product stability.
The AVP is designed to efficiently run Teledyne FLIR Prism AI software providing detection, classification, and target tracking and Prism ISP algorithms including super resolution, image fusion, atmospheric turbulence removal, electronic stabilization, local-contrast enhancement, and noise reduction. Prism software runs efficiently on the AVP leveraging the available system on module (SoM) functions to provide critical edge AI capabilities for automotive, airborne, unmanned, counter-UAS (CUAS), perimeter security, and intelligence, surveillance, and reconnaissance (ISR) applications.
- Products
- Camera Modules & Components
- Software
- FLIR AVP
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Model:
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Industry-Leading Size, Weight, and Power (SWaP) Consumption
Run Prism AI and ISP on the highest-performance QCS8550 SoC in the industry
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FUTURE PROOF YOUR DESIGN
Flexible hardware is part of the Qualcomm Product Longevity Program
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BUILT FOR INTEGRATORS
Simplify development and reduce risk with Prism software and support
Introducing Prism AI
MTI & Object Detection
Counter-UAS
Fine Grained Classifier
Object Detection Air-to-Ground
Object Detection Air-to-Ground
Automotive Autonomy & AEB
Specifications
General
- Memory
- 16GB LPDDR5x
- Part Number
- SOM 4251537
Devkit Part Number: 421-0100-00
- Processor
- Qualcomm QCS8550
64-bit Octa-Core
Application processor at 3.2 GHz (Gold+), 2.8GHz (4 x Gold), 2.0GHz (3 x Silver) Qualcomm Kryo CPU
Qualcomm Adreno GPU 740
Qualcomm Hexagon Tensor Processor (HTP) with Hexagon Vector eXtensions (HVX) and Hexagon Matrix eXtensions (HMX)
Qualcomm Secure Processing Unit for advanced secure use cases
Low Power AI (LPAI) subsystem with dedicated DSP and AI accelerator (eNPU) supporting always-on audio, sensors, contextual data streams, and Always-on camera.
Communication & Data Storage
- Video
- UHD video processing unit
AV1 decode
Native decode support for H.265 Main 10, H.265 Main, H.264 High, and VP9 profile 2
Native encode support for H.265 Main 10, H.265 Main, H.264 high formats
Mechanical
- Dimensions
- SOM Board: 40.27 x 33.41 mm LGA form factor
- Weight
- 5 grams (without shield)
Other
- Operating Environment [OE]
- Input Voltage: 3.6V Operating Temperature: -20 to +60 °C
- Operating System [OS]
- OS - Linux LE (r76)
Storage
- Storage
- 256GB UFS 3.1
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Export Restrictions
Export Restrictions
The information contained in this page pertains to products that may be subject to the International Traffic in Arms Regulations (ITAR) (22 C.F.R. Sections 120-130) or the Export Administration Regulations (EAR) (15 C.F.R. Sections 730-774) depending upon specifications for the final product; jurisdiction and classification will be provided upon request.
